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approved by: date: electronic components group sharp corporation specification prepared by: date: 1 i spec. no. ed-97123a i representative dmsion i opto-electronic devices dn. device specification for business dealing name photocoupler model no. pc3h7 1. these specification sheets include materials protected under copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this product is designed for use in the following application areas : i l oa equipment l audio visual equipment * home appliances * telecommunication equipment cterminal) * measuring equipment * tooling machines * computers 1 if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should b-e taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as : [ * transportation control and safety equipment (aircraft, train, automobile etc.) - traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; [ . space equipment * telecommunication equipment (for trunk lines) * nuclear power control equipment * medical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. customer?s approval date by date presented c-y- f i ) by l \ ?h t. matsumlua. department general manager of engineering dept. ,i1 opto-electronic devices div. elecom group sharp corporation
sharp corporation ed-97123a 1 september 30, 1998 model no. pag e pc3h7 l/11 1. application this specification applies to the outline and characteristics of photocoupler; model no. pc3h7. 2. outline refer to the attached drawing no. cy8375k02. 3. ratings and characteristics refer to the attached sheet, page 4 to 6. 4. reliability refer to the attached sheet, page 7. 5. incoming inspection refer to the attached sheet, page 8. 6. supplement 6.1 isolation voltage shall be measured in the foilowing method. (1) short between anode and cathode on the primary side and between collector and emitter on the secondary side. (2) the dielectric withstand tester with zero-cross circuit shail be used. (3) the wave form of applied voltage shall be a sine wave. 6.2 this product is not designed against irradiation. this product is assembled with electrical input and output. this product incorporates non-coherent light emitting diode. 6.3 packaging specifications refer to the attached sheet, page 9 to 11.
sharp corporation 6.4 collector current (ic) delivery rank table (,, g? mark indicates business dealing name of ordered product) ed-97123a 1 september 30, 199( model no. page pc3h7 2/11 6.5 ods materials this product shall not contain the following materials. also, the following materials shall not be used in the production process for this product. materials for ods : cfc,, halon, carbon tetrachloride. 1.1.1 -trichloroethane (methylchloroform) 6.6 brominated flame retardants speclf?c bromlnated flame retardants such as the pbbo, and pbb, are not used in this device at all. 7. notes refer to the attached sheet- 1- 1, 2.
sharp corporation ed-97123a 1 september 30, 199f model no. pag e pc3h7 3/11 2. outline rankmark date code l l anode mark \ pin nos. and internal connection diagram collector emitter i 0.2 4. 4-to. 2 0 anode 0 cathode epoxy resin product mass : approx. 0.05g *1 ) 2 -digit number shall be marked according to din standard. *21 dimensions in parenthesis are shown for reference. *3) marking is laser marking unit: l/l mm pc3h7 name drawing no. outline dimensions (business dealing name : pc3h71 cy8375k02
sharp corporation ed-97 123a 1 september 30, 199( model no. pag e pc3h7 4/11 3. ratings and characteristics 3.1 absolute maximum ratings ta=25% emitter-collector voltage v ec0 6 v output collector current ic 50 ma *l collector power dissipation pc 150 mw *l total power dissipation ptot 170 mw operating temperature topr -30 to +loo ?c storage temperature tstg -40 to +125 ?c *3 isolation voltage vi.50 2.5 kvrms l 4 soldering temperature tsol 260 ?c *l the derating factors of absolute maximum ratings due to ambient temperature are shown in fig. 1 to 4. *2 pulse widths100 ps, duty ratio : 0.001 (refer to fig. 5) *3 ac for 1 min. 40 to 6o%rh, f=gohz *4 forlos
sharp corporatlon 3.2 electra-optical characteristics ed-97123a 1 september 30. 1998 model no. page pc3h7 5/11 ta=25c collector-emitter output breakdown voltage if=0 emitter-collector bveco i,=10 /la, i,=0 6 - - v breakdown voltage collector current ic i,=lma, vc,=5v 0.2 - 4 ma collector-emitter v cebat) 1,=2oma 0.1 0.2 v saturation voltage ic=lma transfer isolation resistance * rlso dc500v 5xlo?o 10? - q charac - 40 to 6o%rh terlstics floating capacitance cf v=o, f=lmhz 0.6 1.0 pf response time (rise) tr vc,=2v 4 18 /is ic=2ma response time (fall) tf r,=loo r 3 18 ps
shflrp corporation (fig. 1) forward current vs. ambient temperature 50 2 ct. 4o 3 i2 30 2 e 2o e e 10 0 -30 0 25 55 75 100 125 ambient temperature ta (?c ) (fig. 31 collector power dissipation 5 vs. ambient temperature 2ool+l+l+i 150 100 50 0 -30 0 25 50 75 100 125 ambient temperature ta ( ?c ) (fig. 5) peak forward current 2 vs. duty ratio (fig. 2) diode power dissipation vs. ambient temperature u -30 0 25 55 75 100 125 ambient temperature ta ( ?c 1 (fig. 4) total power dissipation vs. ambient temperature 3 g 3 g 200 8 170 f: & 150 8 100 g & 50 ;ii 5 01111111 c- -30 0 25 50 75 100 125 ambient temperature ta ( ?c 1 pulse widths100 p!s ta=25?c duty ratio
4. reliability the reliability of products shall satis@ items listed below. confidence level : 90% ltpd: 10%/20% test items test conditions failure judgement ?1 criteria solderability *2 i 230%, 5s soldering heat *3 i 260%, 10 s terminal strength (bending) *4 weight : 1n 1 time/each terminal mechanical shock 15000m/s2, 0.5ms 3 times/ tx, ty, +z direction variable frequency vibration 100 to 2000 to 1oohz/4min 200m/s2 4 times/ x, y, 2 direction temperature cycling 1 cycle -40 ?c to + 125c (30mi.n) (30mir-i) 20 cycles test high temp. and high +85%, 85%rh, 500h humidity storage high temp. storage i +125?c, loooh low temp. storage i -40-c, 1 oooh operation life 1,=5oma, ptot= 170mw ta=25?c, 1 oooh i n=ll, c=o i u v,>ux 1.2 i n=ll, c=o i i,>ux2 eeo >ux2 ic ux ? *2 sharp corporation ed-97123a 1 september 30, 199; model no. page pc3h7 7/ 1 i upper specification limit l : lower specification limit *1 test method, conforms to jis c 7021. *2 solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. *3 the lead pm depth dipped into solder shall be 0.2mm away from the root of lead pins. *4 terminal bending d irection is shown below. n=22 ,c=o n=22 ,c=o n=22,c=o n=22,c=o n=22 ,c=o 3 y- 90? 90 weight : in 0.2mm or more
sharp corporation model no. pc3h7 pag e 8/11 5. incoming inspection 5.1 inspection items (1) electrical characteristics v,, i,, i,, , vc,,st,, ic, riso, viso (2) appearance 5.2 sampling method and inspection level a single sampling plan, normal inspection level ii based on is0 2859 is applied. the aql according to the inspection items are shown below. minor appearance defect except defect the above mentioned.
sharp corporation pc3h7 9/11 6.3 package specifications 6.3.1 taping conditions (11 tape structure and dimensions (refer to the attached sheet, page 10) the tape shall have a structure in which a cover tape is sealed heat-pressed on the carrier tape. (2) reel structure and dimensions (refer to the attached sheet, page 11) the taping reel shall be of plastic with its dimensions as shown in the attached drawing. (31 direction of product insertion (refer to the attached sheet, page 11) product direction in carrier tape shall direct to the anode mark at the hole side on the tape. (4) joint of tape the cover tape and carrier tape in one reel shall be jointless. (5) the way to repair taped failure devices the way to repair taped failure devices cut a bottom of carrier tape with a cutter, and after replacing to good devices, the cut portion shall be sealed with adhesive tape. 6.3.2 adhesiveness of cover tape l the exfoliation force between carrier tape and cover tape shall be 0.2n to 0.7n for the angle from 160? to 180? . 6.3.3 rolling method and quantity l wind the tape back on the reel so that the cover tape will be outside the tape. attach more than 20cm of blank tape to the trailer and the leader of the tape and 6.x the both ends with adhesive tape. one reel shall contain 3ooopcs. 6.3.4 marking l the outer packaging case shall be marked with following information. * model no. * number of pieces delivered * production date 6.3.5 storage condition l taped products shall be stored at the temperature 5 to 30c and the humidities lower than 7o%rh. 6.3.6 safety protection during shipping l there shall be no deformation of component or degradation of electrical characteristics due to shipping. ed-97123a model no. 1 september 30, 1998 1 page
sharp corporfition f _ d g e /-t (_.-.-. q&.-q -.-. ?#i&) .-.-.-. @ .-.-.-.- 6 -.-.-.-. & c 1 / -i- a k . i i ed-97123a 1 september 307 1998 model no. pag e pc3h7 lo/ll carrier tape structure and dimensions 5omax to.3 k-o.1 to.1 co.1 to.1 to. 1 null 12.0 5.5 1.75 8.0 2.0 4.0 k. l +o.l +o.l -0.0 fo.1 f0.05 ko.1 to.1 -0.0 mm + 1.5 7.5 0.3 2.3 3.1 p 1.6
sharp corporation ed-97123a 1 september 30, 199 model no. page pc3h7 ll/ll reel structure and dimensions a check word a b c d e f g mm 330 13.5t1.5 1oot1 13t0.5 23+1 2.0c0.5 2.0 ko.5 direction of product insertion pull-out direction
sharp corporation ed-97123a model no. 1 september 30. 1998 1 page pc3h7 i attach i precautions for photocouplers 1 for cleaning (1) solvent cleaning : solvent temperature 45c or less immersion for 3 min or less (2) ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, pwb sire or device mounting condition etc. please test it in actual using condition and confirm that doesn?t occur any defect before starting the ultrasonic cleaning. (31 applicable solvent : ethyl alcohol, methyl alcohol, isopropyl alcohol in case when the other solvent is used, there are cases that the packaging resin is eroded. please use the other solvent after thorough confirmation is performed in actual using condition. 2. the led used in the photocoupler generally decreases the light emission power by operation. in case of long operation time, please design the circuit with considering the degradation of the light emission power of the led. (50%/5years)
sharp corporation ed-97123a 1 september 30. 1998 model no. page pc3h7 attach sheet- l-2 3. precautions for soldering photocouplers ( 11 if solder reflow : it is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below. 230c 25c since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition. (2 1 other precautions an inii-ared lamp used to heat up for soldering may cause a localized temperature rise in the resin. so keep the package temperature within that specified in item (1). also avoid immersing the resin part in the solder.

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